MIMX9332XVVXMACR

Manufacturer's product number

MIMX9332XVVXMACR

Manufacturer

NXP USA Inc.

Description

I.MX93 BGA11

Detailed description

I.MX93 BGA11

Download

Manufacturer NXP USA Inc.
Series i.MX 93
Packaging Tape & Reel (TR), Cut Tape (CT), Digi-Reel®
Part Status Active
Core Processor ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width 2, 1 Core, 64-Bit
Speed 250MHz, 1.7GHz
RAM Controllers LPDDR4
Graphics Acceleration No
Ethernet 10/100/1000Mbps (2)
USB USB 2.0 OTG (2)
Voltage – I/O 1.8V
Operating Temperature -40°C ~ 125°C (TJ)
Mounting Type Surface Mount
Package / Case 306-LFBGA
Supplier Device Package 306-LFBGA (11×11)
Additional Interfaces CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Co-Processors/DSP Multimedia; NEON™ MPE
Display & Interface Controllers LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection