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| Manufacturer | NXP USA Inc. |
|---|---|
| Packaging | Tray |
| Part Status | Active |
| Core Processor | ARM® Cortex®-A35, ARM® Cortex®-M33F |
| Number of Cores/Bus Width | 2, 1 Core, 64-Bit |
| Speed | 800MHz, 216MHz |
| RAM Controllers | LPDDR3, LPDDR4, LPDDR4x |
| Graphics Acceleration | Yes |
| Ethernet | 10/100Mbps (1) |
| USB | USB 2.0 (2) |
| Voltage – I/O | 1.8V |
| Operating Temperature | -40°C ~ 105°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 512-VFBGA |
| Supplier Device Package | 512-VFBGA (9.4×9.4) |
| Additional Interfaces | AC'97, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PDM, SAI, SDHC, SPDIF, SPI, UART |
| Co-Processors/DSP | DSP, GPU, Multimedia; NEON™ SIMD |
| Display & Interface Controllers | MIPI-CSI, MIPI-DSI |
| Security Features | A-HAB, ARM TZ, CAAM, Cryptography, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG |
