| Manufacturer |
NXP USA Inc. |
| Series |
i.MX8D |
| Packaging |
Tape & Reel (TR) |
| Part Status |
Active |
| Core Processor |
ARM® Cortex®-A53, ARM® Cortex®-M4F |
| Number of Cores/Bus Width |
3 Core, 64-Bit |
| Speed |
1.2GHz, 264MHz |
| RAM Controllers |
DDR3L, DDR4, LPDDR4 |
| Graphics Acceleration |
Yes |
| Ethernet |
10/100/1000Mbps (1) |
| USB |
USB 2.0 + PHY (2) |
| Voltage – I/O |
1.8V, 2.5V, 3.3V |
| Operating Temperature |
-40°C ~ 125°C (TJ) |
| Mounting Type |
Surface Mount |
| Package / Case |
609-BFBGA |
| Supplier Device Package |
609-FBGA (21×21) |
| Additional Interfaces |
CANbus, I2C, PCIe, SDHC, SPI, UART |
| Co-Processors/DSP |
Multimedia; NEON |
| Display & Interface Controllers |
MIPI-CSI, MIPI-DSI |
| Security Features |
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS |